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. 2022 Dec 22;16(1):96. doi: 10.3390/ma16010096

Figure 8.

Figure 8

Micrograph of interfacial IMC layer on microtextured copper substrate with a dimple depth of (a) 10 µm, (i) magnification of 10×, (ii) magnification of 40×; (b) 30 µm, (iii) magnification of 10×, (iv) magnification of 40×; and (c) 50 µm, (v) magnification of 10×, (vi) magnification of 40×.