Table 2. Reported Encapsulations and Performance Parameters for PSCs Subjected to Long Term Damp Heat Tests with Standard Test Conditions of 85% RH, 85°C (η Denotes Power Conversion Efficiency, η0 Denotes Initial Efficiency)a.
| encapsulation | device type, architecture | η (%) | test time (h), T80 (h) | final η (%) | ref |
|---|---|---|---|---|---|
| EVA encapsulant, butyl rubber edge sealant | PSC, inverted | ∼10–12 | 1000, >1000 | 12% (increase from 10%) | (13) |
| butyl rubber edge seal with desiccant, POE ENLIGHT encapsulant | PSC, inverted | ∼11–13 | 1000, >1000 | 95% of η0 | (42) |
| glass frit encapsulation | PSC, conventional mesoscopic with C | 8.2 | 50, >50 | 100.9% of η0 | (99) |
| no details given | PSC, inverted | 14.76 | 600, >600 | 93.8% of η0 | (135) |
| double layer ALD alumina/hydrophobic coating | PSC, inverted | 19.9 | 500, 500 | 80% of η0 | (62) |
| face sealing adhesive sheet | PSC, conventional | 21.16 | 1070, >1070 | 93.9% of η0 | (131) |
| blanket PIB | PSC, conventional | ∼7–9 | 540, >540 | 98% of η0 | (56) |
| blanket PIB | PSC, conventional | ∼17–19 | 1800, >1800 | 100% of η0 | (12) |
| blanket PIB, UV curable epoxy edge seal | PSC, inverted | ∼20 | 816, 816 | 80% of η0 | (41) |
| PIB edge sealing, cover glass | PSC, conventional | ∼20 | 1000, >1000 | 91.7% of η0 | (43) |
| rGO film | PSC, conventional | – | 1000, >1000 | 85% of η0 | (9) |
| face sealing OLED adhesive sheets | PSC, conventional | 19.7 | 530, >530 | 89.3% of η0 | (134) |
| EVA, butyl rubber edge seal | PSC, inverted | ∼10–12 | 1008, >1008 | ∼12%, increase from 10% | (45) |
| PMMA/SB | PSC, conventional | ∼19 | 100 h, 100 h | 80% of η0 | (76) |
a
Empty spaces in the table indicate that information was not provided, for example, T80 not given, or if the efficiency was given for different device configuration compared to long term stability test.