Skip to main content
. 2023 Feb 15;23(4):2167. doi: 10.3390/s23042167

Figure 3.

Figure 3

Micrograph of a SIRIO charge sensitive preamplifier (650 × 600 µm2) with the bonding-pad pinout. In the inset, a detail of a CZT pixel wire bonded to the preamplifier using a small drop of conductive glue (dark brown circle).