Figure 4.
Schematic diagram of pad defects during bare Cu wire bonding: (a) pad peeling; (b) pad crack; (c) Al splash [72]. Copyright, 2015, IEEE.
Official websites use .gov
A
.gov website belongs to an official
government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you've safely
connected to the .gov website. Share sensitive
information only on official, secure websites.