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. 2023 Feb 11;14(2):432. doi: 10.3390/mi14020432

Figure 7.

Figure 7

(a) Proposed failure mechanism of AuAl Kirkendall micro-voiding and caused lifted ball bond (b) SEM images show very thin CuAl IMC formation on bonded stage of Cu wirebond package prior to reliability stress. No microcracking beneath PdCu ball bond. [103]. Copyright, 2013, ASME Digital Collection.