This PDF file includes:

• Fig. S1. Characteristic of the ZY and XZ pairs (S1 and S3 and S5 and S6, respectively) of the orthogonal magnetic sensors formed on the opposite sides of the respective tube with the field rotating in the XY plane.
• Fig. S2. Characteristic of the XY and XZ pairs (S2 and S4 and S5 and S6, respectively) of the orthogonal magnetic sensors formed on opposite sides of the respective tube with the field rotating in the ZY plane.
• Fig. S3. Characteristic of the XY and ZY pairs (S2 and S4 and S1 and S3, respectively) of the orthogonal magnetic sensors formed on opposite sides of the respective tube with the field rotating in the XZ plane.
• Fig. S4. Electrical breakdown of the sensors due to overheating under electrical stress.
• Fig. S5. Mechanical reliability testing of encapsulated devices.

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