Shichao Zhang
Shichao Zhang
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211800, China, Email: iamxcdong@njtech.edu.cn, Email: xjsong@njtech.edu.cn
a,
Changyu Cao
Changyu Cao
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211800, China, Email: iamxcdong@njtech.edu.cn, Email: xjsong@njtech.edu.cn
a,
Xinyi Lv
Xinyi Lv
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211800, China, Email: iamxcdong@njtech.edu.cn, Email: xjsong@njtech.edu.cn
a,
Hanming Dai
Hanming Dai
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211800, China, Email: iamxcdong@njtech.edu.cn, Email: xjsong@njtech.edu.cn
a,
Zhihao Zhong
Zhihao Zhong
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211800, China, Email: iamxcdong@njtech.edu.cn, Email: xjsong@njtech.edu.cn
a,
Chen Liang
Chen Liang
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211800, China, Email: iamxcdong@njtech.edu.cn, Email: xjsong@njtech.edu.cn
a,
Wenjun Wang
Wenjun Wang
bSchool of Physical Science and Information Technology, Liaocheng University, Liaocheng 252059, China
b,
Wei Huang
Wei Huang
dShaanxi Institute of Flexible Electronics (SIFE), Northwestern Polytechnical University (NPU), Xi’an 710072, China
d,
Xuejiao Song
Xuejiao Song
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211800, China, Email: iamxcdong@njtech.edu.cn, Email: xjsong@njtech.edu.cn
a,✉,
Xiaochen Dong
Xiaochen Dong
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211800, China, Email: iamxcdong@njtech.edu.cn, Email: xjsong@njtech.edu.cn
cSchool of Chemistry and Materials Science, Nanjing University of Information Science & Technology, Nanjing, 210044, China
a,c,✉
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), School of Physical and Mathematical Sciences, Nanjing Tech University (NanjingTech), Nanjing 211800, China, Email: iamxcdong@njtech.edu.cn, Email: xjsong@njtech.edu.cn
bSchool of Physical Science and Information Technology, Liaocheng University, Liaocheng 252059, China
cSchool of Chemistry and Materials Science, Nanjing University of Information Science & Technology, Nanjing, 210044, China
dShaanxi Institute of Flexible Electronics (SIFE), Northwestern Polytechnical University (NPU), Xi’an 710072, China
Received 2023 Aug 17; Accepted 2023 Aug 17; Collection date 2023 Sep 13.
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