Pingping Liang
Pingping Liang
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (Nanjing Tech), 30 South Puzhu Road, Nanjing 211816, China, Email: iamxcdong@njtech.edu.cn, Email: iamwhuang@njtech.edu.cn
a,
Qianyun Tang
Qianyun Tang
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (Nanjing Tech), 30 South Puzhu Road, Nanjing 211816, China, Email: iamxcdong@njtech.edu.cn, Email: iamwhuang@njtech.edu.cn
a,
Yu Cai
Yu Cai
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (Nanjing Tech), 30 South Puzhu Road, Nanjing 211816, China, Email: iamxcdong@njtech.edu.cn, Email: iamwhuang@njtech.edu.cn
a,
Gongyuan Liu
Gongyuan Liu
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (Nanjing Tech), 30 South Puzhu Road, Nanjing 211816, China, Email: iamxcdong@njtech.edu.cn, Email: iamwhuang@njtech.edu.cn
a,
Weili Si
Weili Si
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (Nanjing Tech), 30 South Puzhu Road, Nanjing 211816, China, Email: iamxcdong@njtech.edu.cn, Email: iamwhuang@njtech.edu.cn
a,
Jinjun Shao
Jinjun Shao
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (Nanjing Tech), 30 South Puzhu Road, Nanjing 211816, China, Email: iamxcdong@njtech.edu.cn, Email: iamwhuang@njtech.edu.cn
a,
Wei Huang
Wei Huang
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (Nanjing Tech), 30 South Puzhu Road, Nanjing 211816, China, Email: iamxcdong@njtech.edu.cn, Email: iamwhuang@njtech.edu.cn
a,✉,
Qi Zhang
Qi Zhang
bSchool of Pharmaceutical Sciences, Nanjing Tech University (Nanjing Tech), Nanjing, China, Email: zhangqi@njtech.edu.cn
b,✉,
Xiaochen Dong
Xiaochen Dong
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (Nanjing Tech), 30 South Puzhu Road, Nanjing 211816, China, Email: iamxcdong@njtech.edu.cn, Email: iamwhuang@njtech.edu.cn
a,✉
aKey Laboratory of Flexible Electronics (KLOFE), Institute of Advanced Materials (IAM), Jiangsu National Synergetic Innovation Center for Advanced Materials (SICAM), Nanjing Tech University (Nanjing Tech), 30 South Puzhu Road, Nanjing 211816, China, Email: iamxcdong@njtech.edu.cn, Email: iamwhuang@njtech.edu.cn
bSchool of Pharmaceutical Sciences, Nanjing Tech University (Nanjing Tech), Nanjing, China, Email: zhangqi@njtech.edu.cn
Received 2023 Aug 17; Accepted 2023 Aug 17; Collection date 2023 Sep 27.
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