Junxiong Guo
Junxiong Guo
1School of Electronic Information and Electrical Engineering, Institute of Advanced Study, Chengdu University, Chengdu, 610106 China
2School of Integrated Circuit Science and Engineering, National Exemplary School of Microelectronics, University of Electronic Science and Technology of China, Chengdu, 610054 China
1,2,✉,#,
Shuyi Gu
Shuyi Gu
1School of Electronic Information and Electrical Engineering, Institute of Advanced Study, Chengdu University, Chengdu, 610106 China
1,#,
Lin Lin
Lin Lin
2School of Integrated Circuit Science and Engineering, National Exemplary School of Microelectronics, University of Electronic Science and Technology of China, Chengdu, 610054 China
2,#,
Yu Liu
Yu Liu
3School of Integrated Circuits, Tsinghua University, Beijing, 100084 China
4College of Integrated Circuit Science and Engineering, National and Local Joint Engineering Laboratory for RF Integration and Micro-Packing Technologies, Nanjing University of Posts and Telecommunications, Nanjing, 210023 China
3,4,✉,
Ji Cai
Ji Cai
1School of Electronic Information and Electrical Engineering, Institute of Advanced Study, Chengdu University, Chengdu, 610106 China
1,
Hongyi Cai
Hongyi Cai
1School of Electronic Information and Electrical Engineering, Institute of Advanced Study, Chengdu University, Chengdu, 610106 China
1,
Yu Tian
Yu Tian
5School of Physics and Astronomy, Beijing Normal University, Beijing, 100875 China
6Key Laboratory of Multiscale Spin Physics, Ministry of Education, Beijing, 100875 China
5,6,
Yuelin Zhang
Yuelin Zhang
5School of Physics and Astronomy, Beijing Normal University, Beijing, 100875 China
6Key Laboratory of Multiscale Spin Physics, Ministry of Education, Beijing, 100875 China
5,6,
Qinghua Zhang
Qinghua Zhang
7Institute of Physics, Chinese Academy of Science, Beijing National Laboratory of Condensed Matter Physics, Beijing, 100190 China
7,
Ze Liu
Ze Liu
1School of Electronic Information and Electrical Engineering, Institute of Advanced Study, Chengdu University, Chengdu, 610106 China
1,
Yafei Zhang
Yafei Zhang
1School of Electronic Information and Electrical Engineering, Institute of Advanced Study, Chengdu University, Chengdu, 610106 China
1,
Xiaosheng Zhang
Xiaosheng Zhang
2School of Integrated Circuit Science and Engineering, National Exemplary School of Microelectronics, University of Electronic Science and Technology of China, Chengdu, 610054 China
2,
Yuan Lin
Yuan Lin
8School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 610054 China
8,
Wen Huang
Wen Huang
2School of Integrated Circuit Science and Engineering, National Exemplary School of Microelectronics, University of Electronic Science and Technology of China, Chengdu, 610054 China
2,✉,
Lin Gu
Lin Gu
9School of Materials Science and Engineering, Tsinghua University, Beijing, 100084 China
9,
Jinxing Zhang
Jinxing Zhang
5School of Physics and Astronomy, Beijing Normal University, Beijing, 100875 China
6Key Laboratory of Multiscale Spin Physics, Ministry of Education, Beijing, 100875 China
5,6,✉
1School of Electronic Information and Electrical Engineering, Institute of Advanced Study, Chengdu University, Chengdu, 610106 China
2School of Integrated Circuit Science and Engineering, National Exemplary School of Microelectronics, University of Electronic Science and Technology of China, Chengdu, 610054 China
3School of Integrated Circuits, Tsinghua University, Beijing, 100084 China
4College of Integrated Circuit Science and Engineering, National and Local Joint Engineering Laboratory for RF Integration and Micro-Packing Technologies, Nanjing University of Posts and Telecommunications, Nanjing, 210023 China
5School of Physics and Astronomy, Beijing Normal University, Beijing, 100875 China
6Key Laboratory of Multiscale Spin Physics, Ministry of Education, Beijing, 100875 China
7Institute of Physics, Chinese Academy of Science, Beijing National Laboratory of Condensed Matter Physics, Beijing, 100190 China
8School of Materials and Energy, University of Electronic Science and Technology of China, Chengdu, 610054 China
9School of Materials Science and Engineering, Tsinghua University, Beijing, 100084 China
Subject terms: Nanophotonics and plasmonics, Electrical and electronic engineering
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