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. 2010 Apr 26;10:e31.

Figure 3.

Figure 3

S1805 photoresist mold surfaces (0.5-µm height). (A) Gold pillars of 4-µm width with 18-µm spacing. (B) Silicone impression produced using our peeling protocol taken from the mold in A to produce 4-µm-wide pits with 18-µm spacing.