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. 2014 Jan 2;9(1):10.1371/annotation/21a4e441-0c3f-4319-9833-91d316b99d43. doi: 10.1371/annotation/21a4e441-0c3f-4319-9833-91d316b99d43

Correction: Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

Gan Chong Leong, Hashim Uda
PMCID: PMC3879397

The name of the first author of the article is incorrect. The first author's correct name is: Chong Leong Gan. The correct Citation is:

Chong Leong G, Uda H (2013) Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging. PLoS ONE 8(11): e78705. doi:10.1371/journal.pone.0078705.

The correct abbreviation of the first author's name in the Author Contributions statement is: CLG.

Footnotes

Competing Interests: No competing interests declared.


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