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. 2014 Apr 17;3(3):327–332. doi: 10.1002/mbo3.170

Figure 1.

Figure 1

Scanning electron micrographs of copper surfaces. (A) Surface of industrial rolled copper foil, with the direction of milling being horizontal. (B) Surface of polished copper, with the direction of polishing from right to left, +20° off the normal. (C) Surface of electrodeposited copper.