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. 2020 Nov 16;25(22):5334. doi: 10.3390/molecules25225334

Table 5.

Residues involved in H-bond formation with percentage of how long this bond was presented during 110 ns of simulation.

Ligand Residues Involved in the H-Bond Formation with the Major Contribution
PleD–Ligand4 PHE330 (9.7%), LYS331 (6.01%), LYS441 (5.69%)
PleD–GTP ARG445 (41.44%), LYS331 (15.14%), LYS441 (12.07%), PHE330 (11.95%)