Figure 3.

Automated FIB and cryo lift outs

(A) Cryo-SEM overview of an EM grid covered in clusters of budding yeast. Red asterisks (∗) mark the location of automatically milled lamellae (the inset to the right shows a blown-up view of the region marked by the red dashed box; the insets to the left show the FIB beam's view of a yeast cluster before and after milling and the SEM view of the lamella from the top) (Zachs et al., 2020).

(B) FIB pattern for milling vertical lamella into the top of a vitrified C. elegans worm.

(C) Vertical lamella after milling with cryo-probe attached at the top left corner prior to lift out.

(D) Final lamella after being thinned to ∼300 nm (Mahamid et al., 2015).

Scale bars in the dashed box in (A) and the left inset represent 200 μm and 5 μm, respectively. Scale bars in (B–D) represent 50 μm.